ME54BS62 — nRF54L15 MCU module (evaluated candidate)¶
MinewSemi ME54BS62-1Y15TE — pin-complete candidate from the Rev B2 ECN-19 investigation. Not selected: the measured pattern has deep nulls and the small on-module antenna-GND area makes performance host-layout-sensitive (Minew's own assessment concurs). Documented for reference: the only Minew module with integrated antenna exposing all 30 GPIOs incl. P1.15.
Antenna measurements (Minew eval board)¶
From ME54BS62 ANT V1.0a: peak gain −0.70 dBi / efficiency 42 % (@~2455), ~39 % @ 2480 (centered, flat) → TRP ≈ +4.2 dBm mid-band / +3.9 dBm @ 2480 at +8 dBm TX. Pattern: deep nulls (−20 dB+) along one axis (E-planes) → orientation-dependent dropouts for tags; tiny on-module GND makes eval-board numbers best-case on real hosts.
Minew's alternative for ultra-small: ME54BS61
For small size without RF sacrifice Minew recommends ME54BS61 (6.0 × 6.0 × 1.8 mm, CSP, no integrated antenna — RF pin for on-board or external antenna, max +8 dBm). It fails EverTag's integrated-antenna requirement for the second-source track, but is the preferred candidate for the own-antenna / long-term track (232240–259 blocks): its Single Modular FCC grant + BQB mean the antenna is designed on our PCB under Minew's grant (use the filing's antenna type at equal/lesser gain, per reference layout) instead of certifying a bare-chip radio from scratch. Request Minew's reference antenna design + FCC-filing antenna list before committing. Its certs are in repo: FCC 2BDJ6-ME54BS61 (grant, Single Modular, 2026-06-07), CE verification, BQB DN Q394122 (shared with ME54BS62). Its datasheet rev 1.1.0 contains an antenna example (§7: ME54BE61 adapter, ~18 × 8 mm edge trace antenna, 50 Ω feed — explicitly disclaimed as end-product reference) and PCB rules (§8) that require the RF side to face the board edge ("central area strictly prohibited"), 4 mm RF keep-out, 20 mm to DC-DC converters, and ≥50 mm to other radio modules (ESP32-C5 on gateway variants!). FCC-filing antenna resolved (2026-08-18): the grant was obtained with a third-party external 3 dBi monopole (Xiangboyi XBY200674-C/D, 2400–2500 MHz, VSWR ≤ 1.5, via IPEX on the BE61 adapter — exhibit, fccid.io). Per FCC modular rules (§15.212/KDB 996369) this sets the antenna envelope: same type (monopole family) at ≤ 3 dBi is covered — which a PCB IFA (0–2 dBi typ.) satisfies. To make it bulletproof: document the same-type/lesser-gain rationale in the technical file, use Minew's offered FAE layout review, and preferably ask Minew to C2PC-add our PCB antenna to their grant. Minew also clarified (2026-08-18) that edge placement is a performance recommendation, not a hard rule.
| Manufacturer | Shenzhen Minewsemi Co., Ltd. |
| Ordering code | ME54BS62-1Y15TE (PCB antenna, onboard 32.768 kHz crystal, nRF54L15, external-RF pad option) |
| SoC | Nordic nRF54L15 WLCSP (explicit in datasheet) — 1.5 MB NVM / 256 KB RAM |
| Dimensions | 6.0 × 9.0 × 1.8 mm (−47 % area vs PAN B611-1) |
| Package style | Bottom pad grid A1–G7 (LGA-style, gaps at C3–C5/D3–D5/E3–E5) — no optical inspection of joints; X-ray plan required |
| Antenna | Integrated PCB antenna; pad A1 (RF) for external option — leave N/C |
| Crystals | 32 MHz + 32.768 kHz onboard (Y code) |
| TX / RX | −40…+8 dBm (CSP package supports +8 per Nordic; QFN-based modules are capped at +7) / −96 dBm @ 1 Mbps · range 10–70 m — but weak radiated performance per Minew (antenna GND area) |
| Supply | 1.7–3.6 V (≥ 2.3 V recommended for RF) |
| Currents | TX 5 mA @ 0 dBm, RX 3.2 mA; sleep currents not published |
| Temp range | −40…+105 °C |
| GPIO exposed | 30 — complete for the EverTag superset incl. P1.15 |
| Certifications | FCC 2BDJ6-ME54BS62 (grant, Single Modular, Part 15C, 2026-07-10, 0.006 W conducted) · CE verification · BQB DN Q394122 (cert, 2026-08-10, shared with ME54BS61) · no ISED/SRRC/TELEC received |
| Sourcing | MinewSemi store only (no distributor stock found); ME54BE62 devkit available |
| Datasheet | ME54BS62 Datasheet (local) · Product page |
Module pad ↔ nRF54 GPIO mapping¶
Verify pad order against the datasheet drawing
The datasheet lists several pads per grid row (e.g. "F1–F7: P0.03/P2.09/P2.08/P1.09/P1.11/P1.14/P1.05"). The per-pad assignment below follows list order — confirm each pad against the mechanical drawing before schematic entry, especially rows A and G.
| Pad | Signal | Pad | Signal |
|---|---|---|---|
| A1 | RF (N/C — internal antenna used) | E1 | P0.02 |
| A2 | GND | E2 | P2.10 |
| A3 | P2.04 | E6 | P1.04 (AIN0) |
| A4 | P2.05 | E7 | GND |
| A5 | P2.03 | F1 | P0.03 |
| A6 | P2.01 | F2 | P2.09 |
| A7 | P2.00 | F3 | P2.08 |
| B1 | GND | F4 | P1.09 |
| B2 | P2.06 | F5 | P1.11 (AIN4) |
| B3 | SWDIO | F6 | P1.14 (AIN7) |
| B4 | SWCLK | F7 | P1.05 (AIN1) |
| B5 | P2.02 | G1 | P0.04 |
| B6 | P1.07 (AIN3) | G2 | P2.07 |
| B7 | P1.08 | G3 | GND |
| C1 | P0.00 | G4 | P1.10 |
| C2 | RST | G5 | P1.12 (AIN5) |
| C6 | P1.03 / NFC2 | G6 | P1.13 (AIN6) |
| C7 | P1.06 (AIN2) | G7 | P1.15 |
| D1 | P0.01 | — | — |
| D2 | GND | — | — |
| D6 | P1.02 / NFC1 | — | — |
| D7 | VCC | — | — |
Grid positions C3–C5, D3–D5, E3–E5 have no pads listed. P1.00/P1.01 (LFXO) are internal to the module.
Layout & process notes (from datasheet)¶
- ≥ 4 mm clearance around the antenna end; module at PCB edge recommended; no copper under the antenna area; ferrite-bead isolation suggested on supply.
- Stencil 0.10–0.12 mm, pin-1 aperture 0.9:1 not expanded; single reflow pass recommended on the module side; max 260 °C; MSL bake rules per datasheet if exposed >168 h @ 85 °C/60 %RH or stored >1 year.
- WLCSP-based module — confirm production programming (SWD via B3/B4) and any chip-variant implications with Minew before committing.
Related¶
- MCU Modules overview — cross-module pin table
- Rev B2 ECN-19 — investigation record