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Rev B1 ECN-08 — PAN611 stepped footprint (draft)

Draft — EverTag Station only

Replace the U1 (PAN611) module footprint on Connectivity Module PCBs (232200–232204) so solder pads extend outside the component silkscreen outline (stepped-pin style). Not approved. Current revision is A2. Does not apply to Tag (230220) — see Rev B1 ECN-09 — PAN611 stepped footprint.

Ships in the same B1 respin as Rev B1 ECN-01 — GPIO remap. Update the shared Altium footprint cell together with Rev B1 ECN-03 — PAN611 keep-out and Rev B1 ECN-09 — Tag stepped footprint.

Problem (A2)

The physical PAN611 module uses a stepped-pin package, but the U1 footprint in Gerber is drawn as a bottom-soldering type: pads sit fully under the silkscreen / component outline and do not extend outside the body box.

U1 (PAN611) — A2 footprint: pads hidden under silkscreen outline (EMS review)

This makes production harder:

  • Visual / AOI inspection — no exposed pad edge after placement
  • Stencil aperture design — unclear whether apertures may extend beyond the silkscreen box
  • Placement QA — operators cannot confirm alignment against visible copper

Proposed fix (B1)

Change U1 to a stepped-pin module footprint: rectangular pads extend outside the silkscreen outline so a strip of copper remains visible, matching good practice elsewhere on the board.

IC2 — reference stepped package: pads outside silkscreen outline

A2 (current) B1 (proposed)
Footprint style Bottom-soldering (pads under outline) Stepped-pin (pads extend outside outline)
Pad centres / pitch Per PAN611 land pattern Unchanged — geometry exposure only
Library U1 footprint cell One shared cell — same update as ECN-09 on 230220

Scope

Board U1 (PAN611) B1 change
232200–232204 Yes Update U1 footprint (shared connectivity module layout)
230220 Yes ECN-09 — separate Tag doc
232210, 232211 No Out of scope

No BOM or netlist change expected if pad centres and keep-outs remain per PAN B611-1 Product Specification.

Verification before release

  1. Land pattern — stepped pad extension matches Panasonic module spec (do not copy IC2 dimensions blindly; IC2 is a layout reference only).
  2. Antenna keep-out — extended pads on the antenna side must respect corrected keep-out from ECN-03.
  3. Clearance — check 3D collision with neighbouring passives under U1 (R/C cluster on dense side).
  4. Stencil — document aperture rules for EMS with exposed pad strips.
  5. Shared library — one U1 footprint cell; Tag verification on 230220 under ECN-09.

Open items

  • Confirm stepped pad dimensions with Panasonic land pattern (or module supplier drawing)
  • EMS sign-off on stencil / AOI with stepped U1
  • Regenerate Gerber review package after footprint + keep-out updates