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Rev B1 ECN-09 — PAN611 stepped footprint (draft)

Draft — 230220 only

Replace the U1 (PAN611) module footprint on Tag 230220 so solder pads extend outside the component silkscreen outline (stepped-pin style). Not approved. Current revision is A2.

Same B1 respin as Rev B1 ECN-01 — Tag GPIO remap. Station boards (232200–232204) have a Rev B1 ECN-08 — PAN611 stepped footprint. Technical background and EMS figures: see Station ECN-08 (shared Altium footprint cell).

What changes

EMS feedback: the U1 footprint on A2 is a bottom-soldering type (pads hidden under the silkscreen outline) while the physical PAN611 uses a stepped-pin package. B1 switches to stepped-pin layout — pads extend outside the component outline for inspection and stencil design.

A2 (current) B1 (proposed)
Footprint style Bottom-soldering (pads under outline) Stepped-pin (pads extend outside outline)
Pad centres / pitch Per PAN611 land pattern Unchanged — geometry exposure only
Library U1 footprint cell One shared cell with Station ECN-08

See ECN-08 problem description and reference images (U1 Gerber review + IC2 stepped reference).

Scope

Board Change
230220 Update U1 footprint to stepped-pin style

Tag-specific checks: clearance with accelerometer passives, NFC coil routing, and antenna keep-out from ECN-04.

Verification before release

  1. Land pattern — matches Panasonic PAN B611-1 Product Specification.
  2. Antenna keep-out — extended pads respect corrected keep-out from ECN-04.
  3. Clearance — 3D check vs neighbouring components on compact Tag layout.
  4. Shared library — same U1 cell as Station ECN-08; release only after both product lines sign off.